Invention Grant
- Patent Title: Laminated stamping tool
- Patent Title (中): 层压冲压工具
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Application No.: US11583965Application Date: 2006-10-18
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Publication No.: US07712396B2Publication Date: 2010-05-11
- Inventor: Marlon E. Holmquist , Jeffrey M. Kes
- Applicant: Marlon E. Holmquist , Jeffrey M. Kes
- Applicant Address: US MN Eden Prairie
- Assignee: ADC Telecommunications, Inc.
- Current Assignee: ADC Telecommunications, Inc.
- Current Assignee Address: US MN Eden Prairie
- Agency: Merchant & Gould P.C.
- Main IPC: B21K5/20
- IPC: B21K5/20 ; B23K26/00

Abstract:
A stamping tool and a method of making a punch assembly and a die assembly of the stamping tool. At least one of the punch and die assemblies including a plurality of laser-cut steel plates having hardened edges suitable to withstand high pressures and impacts generated during stamping operations. The assembly further including an internal passage defined by holes formed in a number of plates of the plurality of laser-cut steel plates.
Public/Granted literature
- US20080092622A1 Laminated stamping tool Public/Granted day:2008-04-24
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