Invention Grant
- Patent Title: Fiber architecture for Pi-preforms
- Patent Title (中): 用于Pi预制件的光纤架构
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Application No.: US12059060Application Date: 2008-03-31
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Publication No.: US07712488B2Publication Date: 2010-05-11
- Inventor: Jonathan Goering , Kenneth Ouellette
- Applicant: Jonathan Goering , Kenneth Ouellette
- Applicant Address: US NH Rochester
- Assignee: Albany Engineered Composites, Inc.
- Current Assignee: Albany Engineered Composites, Inc.
- Current Assignee Address: US NH Rochester
- Agency: Frommer Lawrence & Haug LLP
- Agent Ronald R. Santucci
- Main IPC: D03D11/02
- IPC: D03D11/02 ; D03D13/00 ; D03D23/00 ; D03D25/00

Abstract:
A woven preform for a reinforces composite material, which may be woven flat and folded into a shape. The preform has a three-dimensional weave architecture with fill fibers woven to provide layer-to-layer interlocking of layers of warp fiber as well as interlocking of fibers within each layer. At least two legs extend from a base, the base and legs each having at least two layers of warp fibers. The legs can be connected at a symmetrical or asymmetrical, distributed-column intersection, with an even or odd number of columns of warp fibers being located between the legs. The outer ends of the base and/or legs preferably have tapers formed from terminating layers of warp fibers in a stepped pattern.
Public/Granted literature
- US20090247034A1 Fiber Architecture for Pi-Preforms Public/Granted day:2009-10-01
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