Invention Grant
- Patent Title: Heat dissipation apparatus
- Patent Title (中): 散热装置
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Application No.: US11439220Application Date: 2006-05-24
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Publication No.: US07712518B2Publication Date: 2010-05-11
- Inventor: Jung-Wen Chang , Chun-Feng Lai
- Applicant: Jung-Wen Chang , Chun-Feng Lai
- Applicant Address: TW Tao Yuan Shien
- Assignee: Quanta Computer Inc.
- Current Assignee: Quanta Computer Inc.
- Current Assignee Address: TW Tao Yuan Shien
- Agency: Rabin & Berdo, PC
- Priority: TW95202468U 20060213
- Main IPC: F28F7/00
- IPC: F28F7/00

Abstract:
A heat dissipation apparatus used in a computer comprises a heat sink and a star-shaped spring with multiple directional arms, wherein each directional arm extends in a corresponding direction, and the tangent direction of the corresponding contact boundary formed by securing the direction arm to the heat sink is perpendicular to the corresponding direction. The force imposed from the spring on the heat sink is uniform as a result of the perpendicular mechanism.
Public/Granted literature
- US20070187068A1 Heat dissipation apparatus Public/Granted day:2007-08-16
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