Invention Grant
- Patent Title: Connector interface
- Patent Title (中): 连接器接口
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Application No.: US11357642Application Date: 2006-02-17
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Publication No.: US07713085B2Publication Date: 2010-05-11
- Inventor: Hongbin Wu , Dong Yang , Wei Fang , Fengwei Tian , Facan Feng
- Applicant: Hongbin Wu , Dong Yang , Wei Fang , Fengwei Tian , Facan Feng
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Priority: CN200520007642U 20050311
- Main IPC: H01R13/60
- IPC: H01R13/60

Abstract:
The present invention provides a connector interface comprising a connector socket interface and a connector plug interface, the connector socket interface comprising metal shell, insulator, band-shaped recess provided on said insulator and metal contacts and the connector plug interface comprising metal shell, insulator, and band-shaped protrusion provided on said insulator and metal contacts, said connector socket interface and said connector plug interface being able to be coupled together, wherein: said connector socket interface has a plurality of band-shaped recesses and said connector plug interface has a plurality of band-shaped protrusions. In a connector interface with the same number of metal pieces according to an embodiment of the present invention, the footprint of the coupling part is reduced, the footprint per pair of contacts is reduced, and the objective of increasing the pin density of the contacts in a connector is achieved.
Public/Granted literature
- US20080132111A1 Connector interface Public/Granted day:2008-06-05
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