Invention Grant
- Patent Title: Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating
- Patent Title (中): 化学镀用预处理剂，使用其的化学镀方法和化学镀的产物
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Application No.: US10586379Application Date: 2004-11-11
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Publication No.: US07713340B2Publication Date: 2010-05-11
- Inventor: Toshifumi Kawamura , Jun Suzuki , Toru Imori
- Applicant: Toshifumi Kawamura , Jun Suzuki , Toru Imori
- Applicant Address: JP Tokyo
- Assignee: Nippon Mining & Metals Co., Ltd.
- Current Assignee: Nippon Mining & Metals Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Flynn, Thiel, Boutell & Tanis, P.C.
- Priority: JP2004-021128 20040129
- International Application: PCT/JP2004/016764 WO 20041111
- International Announcement: WO2005/073431 WO 20050811
- Main IPC: C23C18/28
- IPC: C23C18/28
Abstract:
The object of the present invention is to provide a pretreating agent for electroless plating that is stable and soluble in organic solvents, a method of electroless plating with excellent adhesiveness using it and an electroless plated product. An object to be plated is pre-treated using a pretreating agent for electroless plating comprising a noble metal soap of naphthenic acid or a fatty acid having 5 to 25 carbon atoms or preferably using a pretreating agent for electroless plating additionally comprising an imidazole silane coupling agent or other silane coupling agent having metal capturing ability, and then electroless plated. The noble metal soap is preferably a palladium soap.
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