Invention Grant
US07713664B2 Method for fabricating an attenuated phase shift photomask by separate patterning of negative and positive resist layers with corresponding etching steps for underlying light-shielding and phase shift layers on a transparent substrate 失效
用于通过对透明基板上的底层光屏蔽和相移层进行相应蚀刻步骤的阴性和正性抗蚀剂层的单独图案化来制造衰减相移光掩模的方法

  • Patent Title: Method for fabricating an attenuated phase shift photomask by separate patterning of negative and positive resist layers with corresponding etching steps for underlying light-shielding and phase shift layers on a transparent substrate
  • Patent Title (中): 用于通过对透明基板上的底层光屏蔽和相移层进行相应蚀刻步骤的阴性和正性抗蚀剂层的单独图案化来制造衰减相移光掩模的方法
  • Application No.: US11367280
    Application Date: 2006-03-06
  • Publication No.: US07713664B2
    Publication Date: 2010-05-11
  • Inventor: Naoyuki Ishiwata
  • Applicant: Naoyuki Ishiwata
  • Applicant Address: JP Yokohama
  • Assignee: Fujitsu Microelectronics Limited
  • Current Assignee: Fujitsu Microelectronics Limited
  • Current Assignee Address: JP Yokohama
  • Agency: Westerman, Hattori, Daniels & Adrian, LLP
  • Priority: JP2005-274717 20050921
  • Main IPC: G03F1/08
  • IPC: G03F1/08 G03F1/14 G03F9/00
Method for fabricating an attenuated phase shift photomask by separate patterning of negative and positive resist layers with corresponding etching steps for underlying light-shielding and phase shift layers on a transparent substrate
Abstract:
A method for fabricating a photomask includes the steps of forming a phase shift layer, a light-shielding layer, and a negative resist layer in that order on a transparent substrate, forming a first resist pattern including a pattern corresponding to a transfer pattern by performing first exposure and development on the negative resist layer, forming a light-shielding pattern by etching the light-shielding layer using the first resist pattern as a mask, removing the first resist pattern, and then forming a positive resist layer thereon, forming a second resist pattern including a pattern corresponding to a light-absorbing pattern by performing second exposure and development on the positive resist layer, and forming a phase shift pattern by etching the phase shift layer using the second resist pattern as a mask.
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