Invention Grant
- Patent Title: Electronic components produced by a method of separating two layers of material from one another
- Patent Title (中): 通过将两层材料彼此分离的方法产生的电子部件
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Application No.: US12075599Application Date: 2008-03-11
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Publication No.: US07713840B2Publication Date: 2010-05-11
- Inventor: Michael Kelly , Oliver Ambacher , Martin Stutzmann , Martin Brandt , Roman Dimitrov , Robert Handschuh
- Applicant: Michael Kelly , Oliver Ambacher , Martin Stutzmann , Martin Brandt , Roman Dimitrov , Robert Handschuh
- Applicant Address: DE München
- Assignee: Osram GmbH
- Current Assignee: Osram GmbH
- Current Assignee Address: DE München
- Agency: Cohen Pontani Lieberman & Pavane LLP
- Priority: DE19640594 19961001
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A semiconductor body selected from the group consisting of a semiconductor layer, a semiconductor layer sequence or a semiconductor layer structure. The semiconductor body is transferred from a growth substrate to a support material by: exposing an interface between the growth substrate and the semiconductor body or a region in the vicinity of said interface to electromagnetic radiation through one of the semiconductor body and the growth substrate; decomposing a material at or in proximity to said interface by absorption of the electromagnetic radiation in proximity to or at said interface so that the semiconductor body can be separated from the growth substrate; and connecting the semiconductor body to the support material.
Public/Granted literature
- US20080164571A1 Electronic components produced by a method of separating two layers of material from one another Public/Granted day:2008-07-10
Information query
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