Invention Grant
US07713858B2 Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
有权
用于互连的碳纳米管 - 焊料复合结构，其制造方法，包含其的封装和含有其的体系
- Patent Title: Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
- Patent Title (中): 用于互连的碳纳米管 - 焊料复合结构，其制造方法，包含其的封装和含有其的体系
-
Application No.: US11394904Application Date: 2006-03-31
-
Publication No.: US07713858B2Publication Date: 2010-05-11
- Inventor: Nachiket Raravikar , Daewoong Suh
- Applicant: Nachiket Raravikar , Daewoong Suh
- Applicant Address: unknown Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: unknown Santa Clara
- Agent John N. Greaves
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A carbon nanotube (CNT) array is patterned on a substrate. The substrate can be a microelectronic die, an interposer-type structure for a flip-chip, a mounting substrate, or a board. The CNT array is patterned by using a patterned metallic seed layer on the substrate to form the CNT array by chemical vapor deposition. The patterned CNT array can also be patterned by using a patterned mask on the substrate to form the CNT array by growing. A computing system that uses the CNT array for heat transfer from the die is also used.
Public/Granted literature
Information query
IPC分类:
