Invention Grant
- Patent Title: Hot melt adhesive based on acrylic block copolymers
- Patent Title (中): 基于丙烯酸嵌段共聚物的热熔胶
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Application No.: US12105838Application Date: 2008-04-18
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Publication No.: US07714052B2Publication Date: 2010-05-11
- Inventor: Charles W. Paul , Cynthia L. Meisner
- Applicant: Charles W. Paul , Cynthia L. Meisner
- Applicant Address: DE Duesseldorf
- Assignee: Henkel AG & Co. KGaA
- Current Assignee: Henkel AG & Co. KGaA
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann
- Main IPC: C08G73/10
- IPC: C08G73/10
Abstract:
High performance, low viscosity hot melt adhesives are obtained using acrylic block copolymers. The level of acrylic block copolymer in the adhesive formulation is less than 50% by weight.
Public/Granted literature
- US20080269404A1 Hot Melt Adhesive Based on Acrylic Block Copolymers Public/Granted day:2008-10-30
Information query
