Invention Grant
- Patent Title: Hetero junction semiconductor device
- Patent Title (中): 异质结半导体器件
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Application No.: US11701429Application Date: 2007-02-02
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Publication No.: US07714352B2Publication Date: 2010-05-11
- Inventor: Yoshio Shimoida , Masakatsu Hoshi , Tetsuya Hayashi , Hideaki Tanaka , Shigeharu Yamagami
- Applicant: Yoshio Shimoida , Masakatsu Hoshi , Tetsuya Hayashi , Hideaki Tanaka , Shigeharu Yamagami
- Applicant Address: JP Yokohama-shi
- Assignee: Nissan Motor Co., Ltd.
- Current Assignee: Nissan Motor Co., Ltd.
- Current Assignee Address: JP Yokohama-shi
- Agency: Foley & Lardner LLP
- Priority: JP2006-031887 20060209; JP2006-032596 20060209
- Main IPC: H01L31/0312
- IPC: H01L31/0312 ; H01L31/036 ; H01L29/10 ; H01L29/93

Abstract:
A semiconductor device, includes: a first conductivity-semiconductor substrate; a hetero semiconductor region for forming a hetero junction with the first conductivity-semiconductor substrate; a gate electrode adjacent to a part of the hetero junction by way of a gate insulating film; a drain electrode connecting to the first conductivity-semiconductor substrate; a source electrode connecting to the hetero semiconductor region; and a second conductivity-semiconductor region formed on a part of a first face of the first conductivity-semiconductor substrate in such a configuration as to oppose the gate electrode via the gate insulating film, the gate insulating film, the hetero semiconductor region and the first conductivity-semiconductor substrate contacting each other to thereby form a triple contact point. A first face of the second conductivity-semiconductor region has such an impurity concentration that allows a field from the gate electrode to form an inversion layer on the first face of the second conductivity-semiconductor region.
Public/Granted literature
- US20070181886A1 Semiconductor device Public/Granted day:2007-08-09
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