Invention Grant
US07714362B2 Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof
有权
具有用于每个输入/输出单元的两个或多个接合焊盘连接的半导体器件及其制造方法
- Patent Title: Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof
- Patent Title (中): 具有用于每个输入/输出单元的两个或多个接合焊盘连接的半导体器件及其制造方法
-
Application No.: US11433731Application Date: 2006-05-12
-
Publication No.: US07714362B2Publication Date: 2010-05-11
- Inventor: Ker-Min Chen
- Applicant: Ker-Min Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L27/118
- IPC: H01L27/118
Abstract:
A semiconductor device including a plurality of input/output cells and having a first bond pad and at least one second bond pad coupled to each input/output cell. The first bond pads comprise a first pattern, and the at least second bond pads comprise at least one second pattern, wherein the at least one second pattern is different from or the same as the first pattern. Either the first bond pads, the at least second bond pads, or both, may be used to electrically couple the input/output cells of the semiconductor device to leads of an integrated circuit package or other circuit component.
Public/Granted literature
Information query
IPC分类:
