Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
- Patent Title (中): 半导体装置及其制造方法
-
Application No.: US11615167Application Date: 2006-12-22
-
Publication No.: US07714385B2Publication Date: 2010-05-11
- Inventor: Kenichi Tokano , Hiroyuki Sugaya
- Applicant: Kenichi Tokano , Hiroyuki Sugaya
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-372739 20051226
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
A semiconductor device, including a first semiconductor layer of the first conductivity type having a plurality of trenches formed therein. A second semiconductor layer of the second conductivity type composed of an epitaxial layer is buried in the trenches in the first semiconductor layer. The trench has surface orientations including a surface orientation of a sidewall at an upper stage made slower in epitaxial growth speed than a surface orientation of a sidewall at a lower stage.
Public/Granted literature
- US20070148931A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2007-06-28
Information query
IPC分类: