Invention Grant
US07714602B2 Socket for connecting ball-grid-array integrated circuit device to test circuit 失效
用于将球栅阵列集成电路器件连接到测试电路的插座

  • Patent Title: Socket for connecting ball-grid-array integrated circuit device to test circuit
  • Patent Title (中): 用于将球栅阵列集成电路器件连接到测试电路的插座
  • Application No.: US11569418
    Application Date: 2005-04-13
  • Publication No.: US07714602B2
    Publication Date: 2010-05-11
  • Inventor: Masahito NaitoTakayuki Nagumo
  • Applicant: Masahito NaitoTakayuki Nagumo
  • Applicant Address: US MN St. Paul
  • Assignee: 3M Innovative Properties Company
  • Current Assignee: 3M Innovative Properties Company
  • Current Assignee Address: US MN St. Paul
  • Agent Johannes P. M. Kusters; Melanie G. Gover
  • Priority: JP2004-154912 20040525
  • International Application: PCT/US2005/012349 WO 20050413
  • International Announcement: WO2005/116666 WO 20051208
  • Main IPC: G01R31/26
  • IPC: G01R31/26 G01R31/02
Socket for connecting ball-grid-array integrated circuit device to test circuit
Abstract:
A simple structure socket 10 for connecting a ball grid array integrated circuit device to a test circuit has a base 14, contacts 26 arranged corresponding to the ball grid array, a nest assembly 16 of two comb structures 70 and a lever assembly 18 for spacing opposed tip portions of each contact away from each other to define a gap for receiving a ball. The lever assembly has two rectangular frames 86 each made of a distal cross piece 94, a proximal cross piece and two side pieces connecting the distal and proximal cross pieces. The two rectangular frames are arranged so that the side pieces are intersected at substantially mid portions thereof. This allows that, by depressing the proximal cross pieces toward the base, the distal cross pieces forces the comb structures toward each other.
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