Invention Grant
- Patent Title: Substrate attachment structure
- Patent Title (中): 基板附件结构
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Application No.: US12121019Application Date: 2008-05-15
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Publication No.: US07715202B2Publication Date: 2010-05-11
- Inventor: Shinji Morita
- Applicant: Shinji Morita
- Applicant Address: JP Osaka
- Assignee: Funai Electric Co., Ltd.
- Current Assignee: Funai Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Global IP Counselors, LLP
- Priority: JP2007-135001 20070522
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
A substrate attachment structure includes a chassis, a substrate and an attachment screw. The chassis includes a hook piece with an engagement prong arranged to face the chassis, and a threaded hole. The substrate includes a screw insertion hole, and a latching hole with a continuous periphery that receives the hook piece of the chassis to sandwich a portion of the substrate between the engagement prong and a part of the chassis. The attachment screw is inserted through the screw insertion hole formed in the substrate and threaded into the threaded hole formed in the chassis to fasten the substrate to the chassis.
Public/Granted literature
- US20080291648A1 SUBSTRATE ATTACHMENT STRUCTURE Public/Granted day:2008-11-27
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