Invention Grant
US07715204B2 Ultrasound probe wiring apparatus 有权
超声波探头接线装置

Ultrasound probe wiring apparatus
Abstract:
Wiring an IC, using flexible circuits, by relating a circuit board to an IC and using traces on the circuit board as a second set of input to the IC. More specifically, a set of first lands on the circuit board are connected to a first set of lands on the IC. The circuit board and IC are positioned so as to present a second set of lands on the circuit board in close proximity to a second set of lands on the IC. A first flex circuit is connected to the second lands on the circuit board while a second flex circuit is connected to the second lands on the IC. The flex circuits may be connected to signal wires or may serve themselves as the main signal wires.
Public/Granted literature
Information query
Patent Agency Ranking
0/0