Invention Grant
- Patent Title: Ultrasound probe wiring apparatus
- Patent Title (中): 超声波探头接线装置
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Application No.: US11220136Application Date: 2005-09-06
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Publication No.: US07715204B2Publication Date: 2010-05-11
- Inventor: David G. Miller
- Applicant: David G. Miller
- Applicant Address: NL Eindhoven
- Assignee: Koninklijke Philips Electronics N.V.
- Current Assignee: Koninklijke Philips Electronics N.V.
- Current Assignee Address: NL Eindhoven
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K7/06 ; H05K7/08 ; H05K7/10

Abstract:
Wiring an IC, using flexible circuits, by relating a circuit board to an IC and using traces on the circuit board as a second set of input to the IC. More specifically, a set of first lands on the circuit board are connected to a first set of lands on the IC. The circuit board and IC are positioned so as to present a second set of lands on the circuit board in close proximity to a second set of lands on the IC. A first flex circuit is connected to the second lands on the circuit board while a second flex circuit is connected to the second lands on the IC. The flex circuits may be connected to signal wires or may serve themselves as the main signal wires.
Public/Granted literature
- US20060036179A1 Ultrasound probe wiring method and apparatus Public/Granted day:2006-02-16
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