Invention Grant
- Patent Title: Semiconductor integrated circuit device
- Patent Title (中): 半导体集成电路器件
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Application No.: US10653901Application Date: 2003-09-04
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Publication No.: US07715869B2Publication Date: 2010-05-11
- Inventor: Satoru Takahashi , Ikuya Ohno , Norio Hayashi , Masachika Ohno , Kazuhiro Tagawa
- Applicant: Satoru Takahashi , Ikuya Ohno , Norio Hayashi , Masachika Ohno , Kazuhiro Tagawa
- Applicant Address: JP Tokyo JP Akita
- Assignee: Hitachi, Ltd.,Akita Electronics Systems Co., Ltd.
- Current Assignee: Hitachi, Ltd.,Akita Electronics Systems Co., Ltd.
- Current Assignee Address: JP Tokyo JP Akita
- Agency: Mattingly & Malur, P.C.
- Priority: JP2002-267494 20020913
- Main IPC: H04M1/00
- IPC: H04M1/00

Abstract:
The semiconductor integrated circuit (RF IC) for a mobile telephone capable of transmitting/receiving the signals of plural bands reduces the DC offsets of the amplifiers located in the following stages of the mixers that demodulate or down-convert the reception signals. The invention scrambles the signal lines to transmit the outputs of the plural mixers that demodulate or down-convert the reception signals of different bands, so as to avoid the adjacent signal lines from making the same combination from the starting ends to the finishing ends.
Public/Granted literature
- US20040051122A1 Semiconductor integrated circuit device Public/Granted day:2004-03-18
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