Invention Grant
- Patent Title: Medical device conductor junctions
- Patent Title (中): 医疗器械导体结
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Application No.: US10830597Application Date: 2004-04-23
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Publication No.: US07715926B2Publication Date: 2010-05-11
- Inventor: Gregory A. Boser , Ryan J. Collins , Mark T. Marshall , Grant H. Wurdell
- Applicant: Gregory A. Boser , Ryan J. Collins , Mark T. Marshall , Grant H. Wurdell
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agency: Mueting, Raasch & Gebhardt, P.A.
- Main IPC: A61N1/05
- IPC: A61N1/05 ; H01R4/24 ; H01R9/053

Abstract:
A medical electrical lead includes a lead body, an inner assembly extending through the lead body, an outer insulative layer covering the inner assembly, and an electrode mounted outside the exterior surface of the outer insulative layer. The inner assembly includes an elongate inner structure forming a lumen, an elongate conductor extending along an outer surface of the inner structure, and a conductive fitting coupled to the elongate conductor.
Public/Granted literature
- US20050240252A1 Novel medical device conductor junctions Public/Granted day:2005-10-27
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