Invention Grant
- Patent Title: Method of manufacturing a fluid ejection device
- Patent Title (中): 制造流体喷射装置的方法
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Application No.: US11612811Application Date: 2006-12-19
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Publication No.: US07716832B2Publication Date: 2010-05-18
- Inventor: Richard Todd Miller , Susanne L Kumpf
- Applicant: Richard Todd Miller , Susanne L Kumpf
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B23P17/00
- IPC: B23P17/00 ; B21D53/76
Abstract:
A heating element of a printhead has a conductive layer deposited over a substrate, and a resistive layer deposited over and in electrical contact with the conductive layer.
Public/Granted literature
- US20070087484A1 Heating Element Of A Printhead Having Resistive Layer Over Conductive Layer Public/Granted day:2007-04-19
Information query
