Invention Grant
- Patent Title: Substrate supporting member and substrate processing apparatus
- Patent Title (中): 基板支撑构件和基板处理装置
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Application No.: US11370145Application Date: 2006-03-08
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Publication No.: US07718007B2Publication Date: 2010-05-18
- Inventor: Kaoru Oohashi , Toshihiro Hayami
- Applicant: Kaoru Oohashi , Toshihiro Hayami
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-076555 20050317
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23F1/00 ; H01L21/306

Abstract:
A substrate supporting member, and a substrate processing apparatus including the substrate supporting member are provided. The substrate supporting member for mounting and supporting a substrate on a substrate supporting surface thereof, and controlling a temperature of the substrate by thermal transfer between the substrate and the substrate supporting surface, wherein the substrate supporting surface is smaller than the substrate, and includes a central region, an intermediate region, and a peripheral region. A thermal conductivity between the substrate and the peripheral region is greater than that between the substrate and the central region which is greater than that between the substrate and the intermediate region located between the central region and the peripheral region.
Public/Granted literature
- US20060207507A1 Substrate supporting member and substrate processing apparatus Public/Granted day:2006-09-21
Information query
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