Invention Grant
US07718007B2 Substrate supporting member and substrate processing apparatus 有权
基板支撑构件和基板处理装置

Substrate supporting member and substrate processing apparatus
Abstract:
A substrate supporting member, and a substrate processing apparatus including the substrate supporting member are provided. The substrate supporting member for mounting and supporting a substrate on a substrate supporting surface thereof, and controlling a temperature of the substrate by thermal transfer between the substrate and the substrate supporting surface, wherein the substrate supporting surface is smaller than the substrate, and includes a central region, an intermediate region, and a peripheral region. A thermal conductivity between the substrate and the peripheral region is greater than that between the substrate and the central region which is greater than that between the substrate and the intermediate region located between the central region and the peripheral region.
Public/Granted literature
Information query
Patent Agency Ranking
0/0