Invention Grant
- Patent Title: Cleaning submicron structures on a semiconductor wafer surface
- Patent Title (中): 清洁半导体晶圆表面上的亚微米结构
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Application No.: US10931093Application Date: 2004-08-30
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Publication No.: US07718009B2Publication Date: 2010-05-18
- Inventor: Steven Verhaverbeke , Jianshe Tang , Roman Gouk , Brian J. Brown , Han-Wen Chen , Ching-Hwa Weng , James S. Papanu , Dennis Yost
- Applicant: Steven Verhaverbeke , Jianshe Tang , Roman Gouk , Brian J. Brown , Han-Wen Chen , Ching-Hwa Weng , James S. Papanu , Dennis Yost
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely Sokoloff Taylor & Zafman, LLP
- Main IPC: C23G1/02
- IPC: C23G1/02
Abstract:
Cleaning solutions and cleaning methods targeted to particular substrates and structures in semiconductor fabrication are described. A method of cleaning fragile structures having a dimension less than 0.15 um with a cleaning solution formed of a solvent having a surface tension less than water while applying acoustic energy to the substrate on which the structures are formed is described. Also, a method of cleaning copper with several different cleaning solutions, and in particular an aqueous sulfuric acid and HF cleaning solution, is described. Also, methods of cleaning both sides of a substrate at the same time with different cleaning solutions applied to the top and the bottom are described.
Public/Granted literature
- US20060042651A1 Cleaning submicron structures on a semiconductor wafer surface Public/Granted day:2006-03-02
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