Invention Grant
- Patent Title: Heat-peelable pressure-sensitive adhesive sheet
- Patent Title (中): 热剥离性粘合片
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Application No.: US10415948Application Date: 2001-11-07
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Publication No.: US07718257B2Publication Date: 2010-05-18
- Inventor: Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi
- Applicant: Akihisa Murata , Toshiyuki Oshima , Yukio Arimitsu , Kazuyuki Kiuchi
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2000-340922 20001108
- International Application: PCT/JP01/09743 WO 20011107
- International Announcement: WO02/38691 WO 20020516
- Main IPC: B32B7/12
- IPC: B32B7/12 ; B32B33/00 ; B32B27/00
Abstract:
A heat-peelable pressure-sensitive adhesive sheet comprises: a base material; and a thermo-expandable pressure-sensitive adhesive layer containing thermo-expandable microspheres, the thermo-expandable pressure-sensitive adhesive layer having a surface to be adhered to an adherend, wherein the surface of the thermo-expandable pressure-sensitive adhesive layer before subjecting to heating has a centerline average roughness of greater than 0.4 μm, and has a convex portion resulting from the thermo-expandable microspheres.
Public/Granted literature
- US20040038020A1 Heat-peelable pressure-sensitive adhesive sheet Public/Granted day:2004-02-26
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