Invention Grant
- Patent Title: Method for preparing an interconnect
- Patent Title (中): 准备互连的方法
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Application No.: US11237333Application Date: 2005-09-28
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Publication No.: US07718295B2Publication Date: 2010-05-18
- Inventor: Karl J. Haltiner, Jr. , Subhasish Mukerjee
- Applicant: Karl J. Haltiner, Jr. , Subhasish Mukerjee
- Applicant Address: US MI Troy
- Assignee: Delphi Technologies, Inc.
- Current Assignee: Delphi Technologies, Inc.
- Current Assignee Address: US MI Troy
- Agent Thomas N. Twomey
- Main IPC: H01M2/00
- IPC: H01M2/00 ; H01B13/00

Abstract:
A method for preparing an interconnect is provided. The method comprises: providing a conductive base sheet including a first face and a second face, the first and second faces are disposed on opposite sides of the base sheet; preparing anode gas flow passages on the first face of the conductive base sheet; preparing cathode gas flow passages on the second face of the conductive base sheet; and selecting anode gas flow passage geometry having a first geometric configuration; and selecting cathode gas flow passage geometry having a second geometric configuration that is different from the first geometric configuration so as to optimize fuel and oxidant gas flow according to system requirements.
Public/Granted literature
- US20070248867A1 Etched interconnect for fuel cell elements Public/Granted day:2007-10-25
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