Invention Grant
- Patent Title: Polymers, resist compositions and patterning process
- Patent Title (中): 聚合物,抗蚀剂组合物和图案化工艺
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Application No.: US11645751Application Date: 2006-12-27
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Publication No.: US07718342B2Publication Date: 2010-05-18
- Inventor: Kenji Funatsu , Tomohiro Kobayashi , Koji Hasegawa , Tsunehiro Nishi
- Applicant: Kenji Funatsu , Tomohiro Kobayashi , Koji Hasegawa , Tsunehiro Nishi
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2005-374831 20051227
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/20 ; G03F7/30 ; G03F7/38

Abstract:
A polymer is provided comprising recurring units having formulas (1), (2), (3), (4), (5), and (6) in amounts of 1-60 mol % (1), 1-60 mol % (2), 1-50 mol % (3), 0-60 mol % (4), 0-30 mol % (5), and 0-30 mol % (6), and having a Mw of 3,000-30,000 and a Mw/Mn of 1.5-2.5. R1, R3, R4, R7, R9, and R11 are H or CH3, Y is methylene or O, R2 is CO2R10 when Y is methylene and R2 is H or CO2R10 when Y is O, R10 is C1-C15 alkyl which may be separated by O, R5 and R6 are H or OH, R8 is a tertiary ester type acid-labile protective group, and R12 is OH-containing fluoroalkyl. A resist composition comprising the polymer has a high resolution and is improved in line edge roughness and I/G bias.
Public/Granted literature
- US20070148594A1 Polymers, resist compositions and patterning process Public/Granted day:2007-06-28
Information query
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