Invention Grant
US07718347B2 Method for making an improved thin film solar cell interconnect using etch and deposition process
失效
使用蚀刻和沉积工艺制造改进的薄膜太阳能电池互连的方法
- Patent Title: Method for making an improved thin film solar cell interconnect using etch and deposition process
- Patent Title (中): 使用蚀刻和沉积工艺制造改进的薄膜太阳能电池互连的方法
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Application No.: US11394723Application Date: 2006-03-31
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Publication No.: US07718347B2Publication Date: 2010-05-18
- Inventor: Peter Borden
- Applicant: Peter Borden
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Pillsbury Winthrop Shaw Pittman
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/70
Abstract:
The present invention provides a method of forming interconnects in a photovoltaic module. According to one aspect, a method according to the invention includes processing steps that are similar to those performed in conventional integrated circuit fabrication. For example, the method can include masks and etches to form isolation grooves between cells, and additional etches to form a conductive step adjacent to the grooves that can be used to form interconnects between cells. According to another aspect the method for forming the conductive step can be self-aligned, such as by positioning a mirror above the module and exposing photoresist from underneath the substrate at an angle one or more times, and etching to expose the conductive step. According to another aspect, the process can include steps to form grid lines in the module to improve current transport in the structure.
Public/Granted literature
- US20070238285A1 Method for making an improved thin film solar cell interconnect using etch and deposition process Public/Granted day:2007-10-11
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