Invention Grant
- Patent Title: Method of metal plating by using frame
- Patent Title (中): 使用框架进行金属电镀的方法
-
Application No.: US11677245Application Date: 2007-02-21
-
Publication No.: US07718350B2Publication Date: 2010-05-18
- Inventor: Akifumi Kamijima
- Applicant: Akifumi Kamijima
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L21/77
- IPC: H01L21/77 ; C25D5/02
Abstract:
The frame plating process of the invention comprises the dry film resist pattern formation step at which a part of the dry film resist is located in such a way as to cap the upper position of the given pattern of opening concavity corresponding to the site needing film thickness precision. It is thus possible to obtain a fairly good film thickness distribution at the specific site needing film thickness precision in a simple manner yet without depending on the film thickness distribution of the plated film based on plating conditions.
Public/Granted literature
- US20080199790A1 METHOD OF METAL PLATING BY USING FRAME Public/Granted day:2008-08-21
Information query
IPC分类:
