Invention Grant
US07718456B2 Package for housing light-emitting element and method for manufacturing package for housing light-emitting element
失效
用于容纳发光元件的封装和用于制造用于容纳发光元件的封装的方法
- Patent Title: Package for housing light-emitting element and method for manufacturing package for housing light-emitting element
- Patent Title (中): 用于容纳发光元件的封装和用于制造用于容纳发光元件的封装的方法
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Application No.: US11664181Application Date: 2005-09-29
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Publication No.: US07718456B2Publication Date: 2010-05-18
- Inventor: Masakatsu Maeda , Yasuyuki Yamamoto
- Applicant: Masakatsu Maeda , Yasuyuki Yamamoto
- Applicant Address: JP
- Assignee: Tokuyama Corporation
- Current Assignee: Tokuyama Corporation
- Current Assignee Address: JP
- Agency: The Webb Law Firm
- Priority: JP2004-286971 20040930
- International Application: PCT/JP2005/018040 WO 20050929
- International Announcement: WO2006/035913 WO 20060406
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/00
Abstract:
A package for housing a light-emitting element wherein a via hole for wiring provided so as to pass through an insulating substrate is arranged in such a manner that it is positioned under a reflector frame; a method for manufacturing the above package for housing a light-emitting element which comprises the steps of separately providing a green sheet for the substrate and a green sheet for the frame, causing a paste containing a ceramic powder to be present between the two green sheets to bind them, and subjecting them to degreasing and sintering, to thereby integrate them.
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