Invention Grant
- Patent Title: Integrated circuit package-on-package stacking system and method of manufacture thereof
- Patent Title (中): 集成电路封装堆叠堆叠系统及其制造方法
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Application No.: US12409491Application Date: 2009-03-24
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Publication No.: US07718472B2Publication Date: 2010-05-18
- Inventor: Dioscoro A. Merilo , Heap Hoe Kuan , You Yang Ong , Seng Guan Chow , Ma. Shirley Asoy
- Applicant: Dioscoro A. Merilo , Heap Hoe Kuan , You Yang Ong , Seng Guan Chow , Ma. Shirley Asoy
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/495 ; H01L23/48
Abstract:
An integrated circuit package-on-package stacking method includes forming a leadframe interposer including: forming a leadframe having a lead; forming a molded base only supporting the lead; and singulating the leadframe interposer from the leadframe.
Public/Granted literature
- US20090179312A1 INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM Public/Granted day:2009-07-16
Information query
IPC分类:
