Invention Grant
- Patent Title: Nonvolatile semiconductor storage device and manufacturing method therefor
- Patent Title (中): 非易失性半导体存储装置及其制造方法
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Application No.: US12318493Application Date: 2008-12-30
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Publication No.: US07718490B2Publication Date: 2010-05-18
- Inventor: Hiroshi Watanabe , Atsuhiro Kinoshita , Akira Takashima , Daisuke Hagishima
- Applicant: Hiroshi Watanabe , Atsuhiro Kinoshita , Akira Takashima , Daisuke Hagishima
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2005-086803 20050324
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/788

Abstract:
A nonvolatile semiconductor storage device includes a semiconductor substrate; a plurality of isolation regions formed in the semiconductor substrate; an element-forming region formed between adjacent isolation regions; a first gate insulating film provided on the element-forming region; a floating gate electrode which is provided on the first gate insulating film and in which a width of a lower hem facing the element-forming region is narrower than a width of the element-forming region in a section taken in a direction perpendicular to a direction in which the isolation regions extend; a second gate insulating film provided on the floating gate electrode; and a control gate electrode provided on the second gate insulating film.
Public/Granted literature
- US20090186474A1 Nonvolatile semiconductor storage device and manufacturing method therefor Public/Granted day:2009-07-23
Information query
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