Invention Grant
- Patent Title: Inverse self-aligned spacer lithography
- Patent Title (中): 反向自对准间隔光刻
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Application No.: US11778852Application Date: 2007-07-17
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Publication No.: US07718529B2Publication Date: 2010-05-18
- Inventor: Yunfei Deng , Ryoung-han Kim , Thomas I. Wallow
- Applicant: Yunfei Deng , Ryoung-han Kim , Thomas I. Wallow
- Applicant Address: KY Grand Cayman
- Assignee: GlobalFoundries Inc.
- Current Assignee: GlobalFoundries Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Ditthavong, Mori & Steiner, P.C.
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
Ultrafine dimensions, smaller than conventional lithographic capabilities, are formed employing an efficient inverse spacer technique comprising selectively removing spacers. Embodiments include forming a first mask pattern over a target layer, forming a spacer layer on the upper and side surfaces of the first mask pattern leaving intermediate spaces, depositing a material in the intermediate spacers leaving the spacer layer exposed, selectively removing the spacer layer to form a second mask pattern having openings exposing the target layer, and etching the target layer through the second mask pattern.
Public/Granted literature
- US20090023298A1 INVERSE SELF-ALIGNED SPACER LITHOGRAPHY Public/Granted day:2009-01-22
Information query
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