Invention Grant
- Patent Title: Curable composition
- Patent Title (中): 可固化组合物
-
Application No.: US10581561Application Date: 2004-12-09
-
Publication No.: US07718749B2Publication Date: 2010-05-18
- Inventor: Katsuhiro Ando , Shintaro Komitsu
- Applicant: Katsuhiro Ando , Shintaro Komitsu
- Applicant Address: JP Osaka-shi
- Assignee: Kaneka Corporation
- Current Assignee: Kaneka Corporation
- Current Assignee Address: JP Osaka-shi
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2003-421662 20031218
- International Application: PCT/JP2004/018350 WO 20041209
- International Announcement: WO2005/059000 WO 20050630
- Main IPC: C08G77/00
- IPC: C08G77/00 ; C08L63/00 ; C08L83/00 ; B32B27/38

Abstract:
The invention aims to improve surface tackiness of a curable composition comprising a reactive silicon group-containing polyoxypropylene polymer without decreasing coating workability, strength, adhesion and appearance. As one embodiment of a means for resolution, a curable composition comprising (A) 100 parts by weight of a reactive silicon group-containing polyoxypropylene polymer, (B) from 0.1 to 20 parts by weight of a silane coupling agent, (C) from 0.1 to 80 parts by weight of an epoxy group-containing compound, (D) from 0.1 to 60 parts by weight of a tertiary amine, and (E) from 0.1 to 30 parts by weight of a primary or secondary amine having a melting point of 20° C. or more is mentioned.
Public/Granted literature
- US20070112145A1 Curable composition Public/Granted day:2007-05-17
Information query