Invention Grant
- Patent Title: Pattern enhancement by crystallographic etching
- Patent Title (中): 通过晶体蚀刻的图案增强
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Application No.: US12108574Application Date: 2008-04-24
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Publication No.: US07718993B2Publication Date: 2010-05-18
- Inventor: Thomas W. Dyer , Kenneth T. Settlemyer , James J. Toomey , Haining Yang
- Applicant: Thomas W. Dyer , Kenneth T. Settlemyer , James J. Toomey , Haining Yang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent H. Daniel Schnurmann
- Main IPC: H01L31/00
- IPC: H01L31/00

Abstract:
A method for producing predetermined shapes in a crystalline Si-containing material that have substantially uniform straight sides or edges and well-defined inside and outside corners is provided together with the structure that is formed utilizing the method of the present invention. The inventive method utilizes conventional photolithography and etching to transfer a pattern, i.e., shape, to a crystalline Si-containing material. Since conventional processing is used, the patterns have the inherent limitations of rounded corners. A selective etching process utilizing a solution of diluted ammonium hydroxide is used to eliminate the rounded corners providing a final shape that has substantially straight sides or edges and substantially rounded corners.
Public/Granted literature
- US20080230868A1 PATTERN ENHANCEMENT BY CRYSTALLOGRAPHIC ETCHING Public/Granted day:2008-09-25
Information query
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