Invention Grant
- Patent Title: Spacing device for modular system
- Patent Title (中): 模块化系统间距装置
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Application No.: US11513849Application Date: 2006-08-31
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Publication No.: US07719855B2Publication Date: 2010-05-18
- Inventor: Stuart Allen Berke , Jeffrey Michael Lewis
- Applicant: Stuart Allen Berke , Jeffrey Michael Lewis
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H05K7/12
- IPC: H05K7/12
Abstract:
A spacing device for adapting electronic modules for insertion into a system is disclosed. In one embodiment, the spacing device includes a body and guide features configured to align the body with mating guide features of electronic modules. The spacing device also includes a coupling portion having coupling arms, which is configured to secure the electronic modules to the body.
Public/Granted literature
- US20080055877A1 Spacing device for modular system Public/Granted day:2008-03-06
Information query
