Invention Grant
- Patent Title: Semiconductor device and fabrication method thereof
- Patent Title (中): 半导体器件及其制造方法
-
Application No.: US11363944Application Date: 2006-03-01
-
Publication No.: US07720124B2Publication Date: 2010-05-18
- Inventor: Satoshi Tamura , Norio Ikedo
- Applicant: Satoshi Tamura , Norio Ikedo
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2005-058385 20050303
- Main IPC: H01S5/00
- IPC: H01S5/00

Abstract:
A semiconductor device includes a first nitride semiconductor layer formed on a substrate and a second nitride semiconductor layer formed on the first nitride semiconductor layer so as to be in contact with the first nitride semiconductor layer. The first nitride semiconductor layer contains a p-type impurity. The second nitride semiconductor layer contains an n-type impurity and a p-type impurity. In the second nitride semiconductor layer, the concentration of the n-type impurity is higher than the concentration of the p-type impurity.
Public/Granted literature
- US20060197104A1 Semiconductor device and fabrication method thereof Public/Granted day:2006-09-07
Information query