Invention Grant
- Patent Title: Opto-semiconductor devices
- Patent Title (中): 光电半导体器件
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Application No.: US12232652Application Date: 2008-09-22
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Publication No.: US07720127B2Publication Date: 2010-05-18
- Inventor: Yutaka Inoue , Kazunori Saitoh , Hiroshi Hamada , Masato Hagimoto , Susumu Sorimachi
- Applicant: Yutaka Inoue , Kazunori Saitoh , Hiroshi Hamada , Masato Hagimoto , Susumu Sorimachi
- Applicant Address: JP Kanagawa
- Assignee: OpNext Japan, Inc.
- Current Assignee: OpNext Japan, Inc.
- Current Assignee Address: JP Kanagawa
- Agency: Stites & Harbison PLLC
- Agent Juan Carlos A. Marquez, Esq.
- Priority: JP2005-095375 20050329
- Main IPC: H01S3/097
- IPC: H01S3/097

Abstract:
An opto-semiconductor device. An opto-semiconductor element includes a semiconductor substrate, a multilayered semiconductor layer formed on a first surface of the semiconductor substrate and having a resonator, a first electrode with multiple conductive layers formed on the multilayered semiconductor layer, and a second electrode formed on a second surface of the semiconductor substrate. A support substrate has a first surface formed with a fixing portion having a conductive layer for fixing the first electrode connected thereto through a bonding material. Bonding material and conductive layers forming the first electrode react to form a reaction layer. The difference in thermal expansion coefficient between semiconductor substrate and support substrate is not more than ±50%. A second barrier metal layer not reactive with bonding material is formed inside the first electrode uppermost conductive layer, while uppermost layer reacts with the bonding material to form the reaction layer.
Public/Granted literature
- US20090041076A1 Opto-semiconductor devices Public/Granted day:2009-02-12
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