Invention Grant
- Patent Title: Board inspection apparatus and method and apparatus for setting inspection logic thereof
- Patent Title (中): 板检查装置及其检查逻辑的设置方法和装置
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Application No.: US11377938Application Date: 2006-03-16
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Publication No.: US07720274B2Publication Date: 2010-05-18
- Inventor: Takatoshi Katahata , Hirotaka Wada , Toshihiro Moriya , Atsushi Shimizu , Akira Nakajima
- Applicant: Takatoshi Katahata , Hirotaka Wada , Toshihiro Moriya , Atsushi Shimizu , Akira Nakajima
- Applicant Address: JP Kyoto
- Assignee: OMRON Corporation
- Current Assignee: OMRON Corporation
- Current Assignee Address: JP Kyoto
- Agency: Osha • Liang LLP
- Priority: JP2005-077285 20050317; JP2006-044312 20060221
- Main IPC: G06K9/00
- IPC: G06K9/00
Abstract:
In generating inspection logic of a new component, the image of a new component is obtained, the trend data for selected characteristics of the focused region of the new component is computed; a previously inspected component having characteristics similar to that of the new component is selected by comparing the trend data of the new component with trend data of the previously inspected component, the image of the selected (previously inspected) component is read from the storage device, and inspection logic for the new component is generated using the images of the new component and images of the previously inspected component as teaching data.
Public/Granted literature
- US20060257015A1 Board inspection apparatus and method and apparatus for setting inspection logic thereof Public/Granted day:2006-11-16
Information query
