Invention Grant
US07723713B2 Layered resistance variable memory device and method of fabrication
有权
分层电阻可变存储器件及其制造方法
- Patent Title: Layered resistance variable memory device and method of fabrication
- Patent Title (中): 分层电阻可变存储器件及其制造方法
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Application No.: US11443266Application Date: 2006-05-31
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Publication No.: US07723713B2Publication Date: 2010-05-25
- Inventor: Kristy A. Campbell , Jiutao Li , Allen McTeer , John T. Moore
- Applicant: Kristy A. Campbell , Jiutao Li , Allen McTeer , John T. Moore
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Dickstein Shapiro LLP
- Main IPC: H01L47/00
- IPC: H01L47/00

Abstract:
The invention is related to methods and apparatus for providing a resistance variable memory element with improved data retention and switching characteristics. According to one embodiment of the invention, a resistance variable memory element is provided having at least one silver-selenide layer in between two glass layers, wherein at least one of the glass layers is a chalcogenide glass, preferably having a GexSe100-x composition. According to another embodiment of the invention, a resistance variable memory element is provided having at least one silver-selenide layer in between chalcogenide glass layers and further having a silver layer above at least one of said chalcogenide glass layers and a conductive adhesion layer above said silver layer. According to the another embodiment of the invention, a resistance variable memory element is provided having a first chalcogenide glass layer, a silver layer over said chalcogenide glass layer, a second chalcogenide glass layer over said silver layer, a second silver layer over said second chalcogenide glass layer, and a conductive adhesion layer over said a second silver layer.
Public/Granted literature
- US20070007506A1 Layered resistance variable memory device and method of fabrication Public/Granted day:2007-01-11
Information query
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