Invention Grant
- Patent Title: Communication bonding systems and methods
- Patent Title (中): 通信粘接系统和方法
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Application No.: US11041320Application Date: 2005-01-24
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Publication No.: US07724742B2Publication Date: 2010-05-25
- Inventor: Allen J. Huotari , Matthew McRae
- Applicant: Allen J. Huotari , Matthew McRae
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Haynes and Boone, LLP
- Main IPC: H04L12/28
- IPC: H04L12/28 ; H04J3/00
Abstract:
Systems and methods are disclosed herein to provide IP bonding. For example, in accordance with an embodiment of the present invention, an IP bonding scheme is disclosed that modifies Generic Routing Encapsulation techniques such that information may be divided and carried through multiple paths (e.g., to improve capacity).
Public/Granted literature
- US20060187911A1 Communication bonding systems and methods Public/Granted day:2006-08-24
Information query
