Invention Grant
US07726002B2 Processes for making spinal intervertebral implant, interconnections for such implant
有权
制造脊柱椎间植入物的过程,用于这种植入物的互连
- Patent Title: Processes for making spinal intervertebral implant, interconnections for such implant
- Patent Title (中): 制造脊柱椎间植入物的过程,用于这种植入物的互连
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Application No.: US10964113Application Date: 2004-10-13
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Publication No.: US07726002B2Publication Date: 2010-06-01
- Inventor: Lawrence A. Shimp , John M. Winterbottom , David R. Kaes , Todd M. Boyce , Erik O. Martz
- Applicant: Lawrence A. Shimp , John M. Winterbottom , David R. Kaes , Todd M. Boyce , Erik O. Martz
- Applicant Address: US NJ Eatontown
- Assignee: Osteotech, Inc.
- Current Assignee: Osteotech, Inc.
- Current Assignee Address: US NJ Eatontown
- Agency: Dorsey & Whitney LLP
- Agent Kenneth E. Levitt
- Main IPC: B23P17/00
- IPC: B23P17/00 ; A61F2/44

Abstract:
A cortical bone implant is formed of two or more planks of bone which are connected with one or more offset pins. The pins may be right circular cylinders inserted into a corresponding offset bore which offset bends the inserted pin. The bending creates compression and tensile loads in the pin which loads creates friction compression forces on the planks connecting them to the pins by friction. The pins may have different shapes to form offset configurations in place of the offset bores for friction attachment to the planks. The implants may be formed of flat or L-shaped planks or bones formed into other shapes including interlocking arrangements. Processes and fixtures are disclosed for forming the pins, planks and implants. Various embodiments of the pins, planks, implants and processes are disclosed.
Public/Granted literature
- US20050107880A1 Spinal intervertebral implant, interconnections for such implant and processes for making Public/Granted day:2005-05-19
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