Invention Grant
- Patent Title: Component-mounting apparatus and component-positioning unit having roller member with sloped positioning surface
- Patent Title (中): 组件安装设备和具有倾斜定位表面的滚轮构件的部件定位单元
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Application No.: US10576837Application Date: 2005-05-16
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Publication No.: US07726012B2Publication Date: 2010-06-01
- Inventor: Hiroki Endo , Teruki Nishi
- Applicant: Hiroki Endo , Teruki Nishi
- Applicant Address: JP
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2004-147043 20040517
- International Application: PCT/JP2005/008854 WO 20050516
- International Announcement: WO2005/112536 WO 20051124
- Main IPC: B23P19/00
- IPC: B23P19/00

Abstract:
A component-mounting apparatus and a component-positioning unit for positioning a component, having a simple structure with reduced manufacturing cost and a significantly higher component-mounting speed. The component-mounting apparatus includes a holding device that holds a component and moves horizontally and a positioning device having a sloped portion for positioning the component held by the holding device when the component comes into contact with the sloped portion. The positioning device comprises a first rotatable roller member having a sloped side surface with which the component comes into contact; and the horizontal movement speed of the holding device substantially agrees with the horizontal component of the peripheral velocity of the first roller member, with which the component comes into contact.
Public/Granted literature
- US20080244899A1 Component-Mounting Apparatus and Component-Positioning Unit Public/Granted day:2008-10-09
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