Invention Grant
US07726013B2 Method of manufacturing circuit board including transfer chip having a plurality of first pad electrodes connected to wiring
有权
包括具有连接到布线的多个第一焊盘电极的传输芯片的电路板的制造方法
- Patent Title: Method of manufacturing circuit board including transfer chip having a plurality of first pad electrodes connected to wiring
- Patent Title (中): 包括具有连接到布线的多个第一焊盘电极的传输芯片的电路板的制造方法
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Application No.: US10680173Application Date: 2003-10-08
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Publication No.: US07726013B2Publication Date: 2010-06-01
- Inventor: Mutsumi Kimura
- Applicant: Mutsumi Kimura
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2002-295134 20021008
- Main IPC: H05K3/30
- IPC: H05K3/30
Abstract:
A circuit board manufacturing method, including forming a transfer chip, the forming of the transfer chip including, forming a wiring above a first substrate, forming a plurality of first pad electrodes so as to be connected to the wiring and so as to be included in the transfer chip, and joining the transfer chip with a member such that the plurality of first pad electrodes contact the member.
Public/Granted literature
Information query
