Invention Grant
- Patent Title: Device, method and program for inspecting microstructure
- Patent Title (中): 用于检查微观结构的装置,方法和程序
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Application No.: US11885432Application Date: 2006-03-02
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Publication No.: US07726190B2Publication Date: 2010-06-01
- Inventor: Toshiyuki Matsumoto , Naoki Ikeuchi , Masami Yakabe , Keiichi Enjoji , Masato Hayashi
- Applicant: Toshiyuki Matsumoto , Naoki Ikeuchi , Masami Yakabe , Keiichi Enjoji , Masato Hayashi
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP2005-059061 20050303
- International Application: PCT/JP2006/303996 WO 20060302
- International Announcement: WO2006/093232 WO 20060908
- Main IPC: G01N29/00
- IPC: G01N29/00 ; H01L41/00

Abstract:
A speaker unit has a plurality of sound sources each outputting a sound wave. The compressional, sound wave output from the speaker unit arrives, or vibrates air, which moves a movable part of a three-axis acceleration sensor, or a microstructure of a chip to be tested TP. As the movable part thus moves, a value in resistance accordingly varies, and such variation is measured as based on an output voltage provided via a probe. A control unit determines a property of the three-axis acceleration sensor from a value in property as measured or measurement data. Furthermore, the plurality of sound sources can be spaced by a pitch of a predetermined value set as based on their difference in the distance to the movable part of the three-axis acceleration sensor and the wavelength of the test wave to apply a composite test wave to the movable part such that the composite sound wave's composite sound field is maximized.
Public/Granted literature
- US20080190206A1 Device, Method and Program for Inspecting Microstructure Public/Granted day:2008-08-14
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