Invention Grant
- Patent Title: Heat pipe
- Patent Title (中): 热管
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Application No.: US11309435Application Date: 2006-08-04
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Publication No.: US07726384B2Publication Date: 2010-06-01
- Inventor: Chuen-Shu Hou , Tay-Jian Liu , Chao-Nien Tung
- Applicant: Chuen-Shu Hou , Tay-Jian Liu , Chao-Nien Tung
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Foxconn Technology Co., Ltd.
- Current Assignee: Foxconn Technology Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Jeffrey T. Knapp
- Main IPC: F28D15/04
- IPC: F28D15/04

Abstract:
A heat pipe includes a hollow metal casing (100) and a honeycombed wick structure (200) arranged at an inner surface of the hollow metal casing. The wick structure includes a plurality of slices (210, 220) stacked together. Each of the slices has a plurality of pores therein and a plurality of protrusions (222) formed thereon along a longitudinal direction of the heat pipe to form a plurality of liquid channels (230) in the wick structure along the longitudinal direction of the heat pipe. Each liquid channel has alternate large and small sections (232, 231) along a length thereof.
Public/Granted literature
- US20070277963A1 HEAT PIPE Public/Granted day:2007-12-06
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