Invention Grant
- Patent Title: Heat exchangers
- Patent Title (中): 热交换器
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Application No.: US10587396Application Date: 2005-05-11
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Publication No.: US07726387B2Publication Date: 2010-06-01
- Inventor: Naohisa Higashiyama
- Applicant: Naohisa Higashiyama
- Applicant Address: JP Tokyo
- Assignee: Showa Denko K.K.
- Current Assignee: Showa Denko K.K.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2004-140527 20040511; JP2004-332637 20041117
- International Application: PCT/JP2005/009007 WO 20050511
- International Announcement: WO2005/108899 WO 20051117
- Main IPC: F28F9/22
- IPC: F28F9/22 ; F28D1/053

Abstract:
An evaporator 1 comprises a heat exchange core 4 having heat exchange tubes 12 in groups 13, a refrigerant inlet header 5 and a refrigerant outlet header 6 which are arranged toward one end of each of the heat exchange tubes 12, and a refrigerant inflow header 9 and a refrigerant outflow header 11 which are arranged toward the other end of each heat exchange tube 12. The outflow header 11 has its interior divided by a flow dividing control wall 52 into two spaces 11a, 11b arranged one above the other. The inflow header 9 and the lower space 11b of the outflow header 11 are held in communication each at one end thereof. The control wall 52 has a plurality of refrigerant passing holes 53 arranged at a spacing longitudinally thereof.
Public/Granted literature
- US20070158057A1 Heat exchangers Public/Granted day:2007-07-12
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