Invention Grant
- Patent Title: Damper device
- Patent Title (中): 减震装置
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Application No.: US11859115Application Date: 2007-09-21
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Publication No.: US07726626B2Publication Date: 2010-06-01
- Inventor: Tokuyuki Akabane
- Applicant: Tokuyuki Akabane
- Applicant Address: JP
- Assignee: Nidec Sankyo Corporation
- Current Assignee: Nidec Sankyo Corporation
- Current Assignee Address: JP
- Agency: Cantor Colburn LLP
- Priority: JP2006-256132 20060921
- Main IPC: F16K31/04
- IPC: F16K31/04

Abstract:
A damper device may include a frame, a baffle turnably supported on the frame, a drive unit for turnably driving the baffle, a first and a second turnable support parts for supporting the baffle on the frame, and a mechanical connecting part between the drive unit and the baffle which is structured at a position apart from a turning center axial line of the baffle. The first and second turnable support parts are structured by using a shaft part made of resin which is formed in one of the baffle and the frame, and a shaft hole which is formed in the other of the baffle and the frame. A passage through which cold air is passed is opened and closed by the baffle.
Public/Granted literature
- US20080072966A1 DAMPER DEVICE Public/Granted day:2008-03-27
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