Invention Grant
- Patent Title: Structure for connecting heat exchangers
- Patent Title (中): 热交换器连接结构
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Application No.: US11579211Application Date: 2004-11-19
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Publication No.: US07726697B2Publication Date: 2010-06-01
- Inventor: Toshimichi Kobayashi
- Applicant: Toshimichi Kobayashi
- Applicant Address: JP
- Assignee: T. Rad. Co., Ltd.
- Current Assignee: T. Rad. Co., Ltd.
- Current Assignee Address: JP
- Agency: Christopher & Weisberg, P.A.
- Priority: JP2004-135225 20040430
- International Application: PCT/JP2004/017250 WO 20041119
- International Announcement: WO2005/106370 WO 20051110
- Main IPC: F16L55/00
- IPC: F16L55/00
Abstract:
A connection structure is provided for connecting heat exchangers (11, 12) to each other for exchanging heat between a first fluid flowing in body parts (13, 14) and a second fluid flowing in heat transfer pipes (15, 16) disposed in the body parts (13, 14). The connection structure includes connection holes (17, 18) provided in the body parts (13, 14) of the heat exchangers (11, 12) and a press-formable connection member (19), connected to the outer surfaces of the body parts (13, 14) for fluidly coupling the connecting holes (17, 18) so that the body parts (13, 14) are allowed to communicate with each other.
Public/Granted literature
- US20080000461A1 Structure for Connecting Heat Exchangers Public/Granted day:2008-01-03
Information query
