Invention Grant
- Patent Title: Vacuum suction head
- Patent Title (中): 真空吸头
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Application No.: US10543726Application Date: 2004-01-28
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Publication No.: US07726715B2Publication Date: 2010-06-01
- Inventor: Shigeki Nagasawa , Kiyoshi Takamatsu
- Applicant: Shigeki Nagasawa , Kiyoshi Takamatsu
- Applicant Address: JP Osaka
- Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
- Current Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McGlew and Tuttle, P.C.
- Priority: JP2003-020620 20030129
- International Application: PCT/JP2004/000785 WO 20040128
- International Announcement: WO2004/067234 WO 20040812
- Main IPC: B25J15/06
- IPC: B25J15/06

Abstract:
An etchable plate-shaped material is used as a vacuum suction pad 31. On one surface thereof, a large number of independent protruded portions and recessed portions are formed to provide a suction part 33b. Further, a periphery of the suction part is annularly formed to provide an airtight part 33a. When the vacuum suction pad 31 comes close to a substrate to be sucked, a skirt pad 32 with a slit 32d is integrally formed in the shape of a hemmed hat using an elastic member, in order to block outside air into a peripheral space of the vacuum suction pad 31. With this arrangement, it is possible to prevent the substrate from being locally deformed when the substrate is sucked by discharging air from a suction port 36 and to widen a clearance between the vacuum suction pad and the substrate such as a liquid crystal panel, at which the suction is possible.
Public/Granted literature
- US20060232085A1 Vacuum suction head Public/Granted day:2006-10-19
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