Invention Grant
- Patent Title: Ring binder mechanism
- Patent Title (中): 环夹机构
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Application No.: US11675493Application Date: 2007-02-15
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Publication No.: US07726897B2Publication Date: 2010-06-01
- Inventor: Chun Yuen To , Chun Hai Lin
- Applicant: Chun Yuen To , Chun Hai Lin
- Applicant Address: HK Kwai Chung, New Territory
- Assignee: World Wide Stationery Mfg. Co., Ltd.
- Current Assignee: World Wide Stationery Mfg. Co., Ltd.
- Current Assignee Address: HK Kwai Chung, New Territory
- Agency: Senniger Powers LLP
- Main IPC: B42F13/20
- IPC: B42F13/20

Abstract:
A ring mechanism having a housing and at least one ring configurable between a closed position for retaining loose-leaf pages and an open position. A pair of hinge plates, operatively connected to the ring, are pivotable within the housing between first and second position corresponding respectively to the closed and open positions of the ring. Each hinge plate has a free end and a line of weakness formed therein proximate the free end to facilitate bending of the hinge plate. A hinge plate actuator has a bearing surface engageable with the hinge plates proximate the free ends thereof upon movement of the actuator from a first position toward a second position thereof such that the hinge plates bend proximate their free ends to delay pivoting movement of the hinge plates upon initial movement of the actuator from its first position toward its second position.
Public/Granted literature
- US20070160415A1 Ring Binder Mechanism Public/Granted day:2007-07-12
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