Invention Grant
US07727294B2 Thin micro reforming apparatus having reduced back pressure in evaporator thereof
失效
薄型微型重整装置在其蒸发器中具有降低的背压
- Patent Title: Thin micro reforming apparatus having reduced back pressure in evaporator thereof
- Patent Title (中): 薄型微型重整装置在其蒸发器中具有降低的背压
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Application No.: US11544617Application Date: 2006-10-10
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Publication No.: US07727294B2Publication Date: 2010-06-01
- Inventor: Jae Hyoung Gil , Jae Hyuk Jang , Sung Han Kim
- Applicant: Jae Hyoung Gil , Jae Hyuk Jang , Sung Han Kim
- Applicant Address: KR Kyungki-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Kyungki-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2005-0095085 20051010
- Main IPC: B01J10/00
- IPC: B01J10/00 ; B01J3/00

Abstract:
The invention relates to a thin micro reforming apparatus used in a fuel cell system with decreased back pressure in an evaporator thereof. In the reforming apparatus, a substrate has a flow path therein and a fuel inlet portion for introducing fuel into the flow path of the substrate. An evaporator includes a gas expansion part which gasifies the liquid fuel and a back pressure accommodation part which accommodates back pressure during the gasification to block the influence of the back pressure to the fuel inlet portion. A reformer has a flow path formed downstream of the evaporator, reforming fuel into hydrogen gas via heat absorption reaction. A CO remover has a flow path formed downstream of the reformer, removing CO gas contained in the hydrogen gas via heat generation reaction. A cover is attached to an upper part of the substrate to seal the substrate from the external environment.
Public/Granted literature
- US20070081929A1 Thin micro reforming apparatus having reduced back pressure in evaporator thereof Public/Granted day:2007-04-12
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