Invention Grant
US07727344B2 Copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate
失效
铜合金适用于设置在塑料基板上的针格阵列的IC引脚
- Patent Title: Copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate
- Patent Title (中): 铜合金适用于设置在塑料基板上的针格阵列的IC引脚
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Application No.: US10361709Application Date: 2003-02-06
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Publication No.: US07727344B2Publication Date: 2010-06-01
- Inventor: Takashi Miyoshi , Tsutomu Saito , Isao Takahashi
- Applicant: Takashi Miyoshi , Tsutomu Saito , Isao Takahashi
- Applicant Address: JP Tokyo
- Assignee: The Furukawa Electric Co., Ltd.
- Current Assignee: The Furukawa Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2000-130906 20000428
- Main IPC: C22F1/08
- IPC: C22F1/08 ; C22C9/00 ; C22C9/10
Abstract:
A copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate, which copper alloy is a Cu—Zn—Mg alloy, a Cu—Sn alloy, a Cu—SN—Ag alloy, a Cu—Fe—Zn—P alloy, or a Cu—Cr alloy, each having a given alloy composition, in which the copper alloy has conductivity of 50% IACS or more and tensile stress of 400 MPa to 650 MPa.
Public/Granted literature
- US20030121573A1 Copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate Public/Granted day:2003-07-03
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