Invention Grant
- Patent Title: Heat transfer fluids with carbon nanocapsules
- Patent Title (中): 带有碳纳米胶囊的传热流体
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Application No.: US11473246Application Date: 2006-06-23
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Publication No.: US07727414B2Publication Date: 2010-06-01
- Inventor: Gan-Lin Hwang
- Applicant: Gan-Lin Hwang
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW94142041A 20051130
- Main IPC: C09K5/00
- IPC: C09K5/00

Abstract:
A heat transfer fluid with carbon nanocapsules. The heat transfer fluid comprises a fluid and a plurality of carbon nanocapsules, uniformly dispersed in the fluid, in an amount of 0.05 to 10 parts by weight, based on 100 parts by weight of the heat transfer fluid. Particularly, the carbon nanocapsules are modified to bond with at least one kind of functional group, improving dispersiblity in the fluid. Thus, since the carbon nanocapsules are apt to disperse in fluid and have superior thermal conductivity, the heat conduction capability of the heat transfer fluid therewith is enhanced.
Public/Granted literature
- US20100108937A1 HEAT TRANSFER FLUIDS WITH CARBON NANOCAPSULES Public/Granted day:2010-05-06
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